Reflow Ovens

EPS makes a revolutionary reflow oven for the SMT market, designed with patented Horizontal Convection technology* for even heating across the entire face of the PCB. Models range from a traditional benchtop solder reflow oven to batch ovens to automatic floor style systems. Also selections for reflow soldering using hot plates and vapor phase ovens are located here.

You can compare up to three products within a single category. Choose from the following:

RF500 Conveyor Reflow Oven
Ten (10) heating zone conveyor reflow oven with (1745mm) long heating tunnel for low to medium volume surface mount assembly.
   
RF300 Conveyor Reflow Oven
Six (6) heating zone conveyor reflow oven with (850mm) long heating tunnel for low to medium volume surface mount assembly.

 



Products & Services

      VisionXS
      VisionXC
Simply. More. Technique.

A combination of innovative spirit, expertise and experience is the basis on which our future-oriented systems are developed. The Rehm reflow soldering systems have more than 20 years of research and development in convection soldering behind them. Innovative ideas and first-class expertise in the field of machine construction are clearly demonstrated in the VisionXP series. The result is process stability, minimal maintenance requirements, ease of operation and a comprehensive service package that leaves nothing to be desired. These features make the VisionXP Rehm’s most sought-after soldering system.

Highlights
System variety

 
> Download Flyer


The PLUS for your production! - The new VisionXP+

Energy efficient production and an environmentally friendly use of resources are the greatest strengths of the VisionXP+. The machine represents a further development of the proven VisionXP, and thereby also shines with the process safety and residue management system of their predecessors. At constant soldering quality VisionXP + allows an energy savings of up to 20%.
Through reduced maintenance and improved energy efficiency, the system is the best investment in a future-oriented and sustainable production in the high-end range. Of course, the user-friendly system also comes with the usual full-service package.

Your PLUS Overview

+ Highest Energy Efficiency
+ Monitoring Tools to Measure
   Consumption
+ Tools to Control Power Consumption
+ Reduced Waste Heat
+ Most Efficient Cooling Section
+ Optimized Maintenance Intervals
+ Filter Monitoring with Active
   Exhaust Readjustment
+ Minimum Noise Levels

> Download Flyer

 

Products & Services

      VisionXS
      VisionXC
Simply. More.Technique.

The VisionXC, Rehm meets the request of electronic manufacturers with smaller batch sizes to offer a cost-effective system which still corresponds to the demands placed on it with regard to process performance.  The VisionXC is available with a reduced option package suited to the needs of these customers.

VisionXC – compact design with best thermal performance!


> Download Flyer

 

 

CONDENSATION

 

Products & Services

Void Expert – Expert Database

The occurrence of voids is surely one of the most interesting phenomena associated with soft soldering. As a rule, larger or smaller voids can be found in most solder joints, which are formed as the result of gas which is trapped in the molten solder. When the molten solder hardens, these gas bubbles are frozen into place.
The reliability of most solder joints is not necessarily influenced decisively by voids contained within them, although there are exceptions. For example, sensitivity to voids is taking on new dimensions with regard to evolving package trends such as LGAs and QFNs. The greater the power loss which has to be dissipated via a solder joint, the lower its tolerability to voids is. In particular solder joints in power semiconductor devices should be nearly void-free.
This expert database makes a considerable contribution to understanding the mechanisms involved in the occurrence of voids and outgassing, and identifying the essential influencing variables. Influencing variables and the ways in which they interact are explained in a very clear-cut manner with reference to the respective response variables. Various graphics and Pareto charts help to clarify the interrelationships, which are quite complex in some cases. This allows the user to draw conclusions regarding how voids can be minimized for certain applications. The expert database developed by Dr. Wohlrabe from the Dresden Technical University presents results which are based on work conducted by the voids workgroup and knowledge gained through previous projects (in some cases subsidized projects), as well as the international literature. Experiments conducted to this end were evaluated by means of statistical methods. The discussion attempts to clarify in particular controversial effects and contradictions.

• Database with freely selectable access to experimental results and comparison thereof as desired
• Graphics export
• Comprehensive documentation section

Price: €997.00 + VAT




> Void Expert - Demo Version

> Void Expert - Read me (Demo Version)

> Void Expert - Full Version

> Void Expert - Read me (Full Version)

 

Products & Services

Simply. More. Technique.

In fact, Condenso from Rehm Thermal Systems is a state-of-the-art condensation reflow soldering solution. Addressing the complex demands of lead-free solder alloys for PCBs with a large thermal mass, Condenso will solder your most difficult PCBs quickly, void free  and reliably for maximum return on investment.

Top quality soldering results without compromise

Condenso brings major design advantages over traditional vapor phase soldering systems, making it the first choice for top quality soldering results.

Performance:  Vapor in condensation soldering provides extremely effective heat transfer, while also keeping the temperature of the medium constant. The specific boiling point limits the system’s maximum soldering temperature, preventing overheating and guaranteeing a repeatable performance you can trust. The addition of Vacuum will secure a void free soldering connection.

Reliability: Vaporizing a defined quantity of inert gas during reflow, the system ensures precision temperature profiling to eliminate the potential for component damage.  Maximum profile flexibility can be achieved utilizing Condenso’s precision medium injection timing and quantity control, and even its exhaust. Your profiling possibilities are almost limitless.

Value: Horizontal PCB transportation ensures that components cannot be shifted out of place during soldering, reducing scrap rates and enhancing long-term cost-of-ownership. “On-demand” operation enables the system to idle when not in use, and requires just a momentary warm-up cycle before production resumes. This results in lower power and fluid consumption than that of systems which run continuously throughout production shifts.

 
> Download Flyer

Highlights

+ top quality soldering results
+ pinpoint temperature accuracy
+ improved thermal transfer
+ no overheating components
+ void-free vacuum soldering
+ no component movement
+ no residues
+ no pre-heat necessary
+ maximum profile flexibility
+ faster cleaning

> Voidfree Soldering - Profit from our Expert Database!

 



MEDIUM VOLUME : EPS

Reflow Ovens

EPS makes a revolutionary reflow oven for the SMT market, designed with patented Horizontal Convection technology* for even heating across the entire face of the PCB. Models range from a traditional benchtop solder reflow oven to batch ovens to automatic floor style systems. Also selections for reflow soldering using hot plates and vapor phase ovens are located here.



You can compare up to three products within a single category. Choose from the following:

Floor Mounted

14FS Single and 14FD Dual Wave Solder Machines    RF500 Conveyor Reflow Oven
Ten (10) heating zone conveyor reflow oven with (1745mm) long heating tunnel for low to medium volume surface mount assembly.
 More info

Table Top

14FS Single and 14FD Dual Wave Solder Machines    RF300 Conveyor Reflow Oven
Six (6) heating zone conveyor reflow oven with (850mm) long heating tunnel for low to medium volume surface mount assembly.
 More info
News And Events

Visit us at A4-149

New ESS Selective Soldering Machines Entry into automated selective soldering has never been more affordable.
Product details and specs .

New WSM-310F Wave Soldering Machine with Finger Conveyor for boards up to 12" (310mm) 
Product details and specs.

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